Bismaleimide
It is the best additive to obtain high heat resistance.
Bismaleimide is a useful resin additive that can impart high mechanical strength and high heat resistance due to its rigid structure. The maleimide group does not generate volatile by-products and undergoes a heavy addition reaction, so it can be cured without causing voids.
JBM-200N
Cas No. 105391-33-1
| Product name | JBM-200N | |
|---|---|---|
| Compound name | Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane | |
| Chemical Name | Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane | |
| Molecular formula | C27H26N2O4 | |
| Reg. No. | CAS No. | 105391-33-1 |
| ENCS | 4-1729 | |
| ISHL | 8-(1)-2032 | |
| TSCA | Registered | |
| EINECS | 4-1729 | |
| Product specifications | Appearance | White powder |
| Purity | ≧95％ | |
| Properties | Molecular weight | 442.52 |
| Melting point | 170±10℃ | |
| Boiling point | – | |
| Application examples | Electronic material | |
| Production scale | Development product |
JBM-300N
Cas No. 13132-94-0
| Product name | JBM-300N | |
|---|---|---|
| Compound name | 2,2-Bis[4-(4-maleimidophenoxy)phenyl]propane | |
| Chemical Name | 2,2-Bis[4-(4-maleimidophenoxy)phenyl]propane | |
| Molecular formula | C20H12N2O5 | |
| Reg. No. | CAS No. | 13132-94-0 |
| ENCS | – | |
| ISHL | – | |
| TSCA | – | |
| EINECS | – | |
| Product specifications | Appearance | Yellow powder |
| Purity | ≥95% | |
| Properties | Molecular weight | 360.32 |
| Melting point | 180±10℃ | |
| Boiling point | – | |
| Application examples | Electronic material | |
| Production scale | Development product |
JBM-800N
Cas No. 79922-55-7
| Product name | JBM-800N | |
|---|---|---|
| Compound name | 2,2-Bis[4-(4-maleimidophenoxy)phenyl]propane | |
| Chemical Name | 2,2-Bis[4-(4-maleimidophenoxy)phenyl]propane | |
| Molecular formula | C35H26N2O6 | |
| Reg. No. | CAS No. | 79922-55-7 |
| ENCS | 5-6344 | |
| ISHL | 8-(1)-2192 | |
| TSCA | Registered | |
| EINECS | 5-6344 | |
| Product specifications | Appearance | Yellow powder |
| Purity | ≥95% | |
| Properties | Molecular weight | 570.6 |
| Melting point | 165±10℃ | |
| Boiling point | – | |
| Application examples | Electronic material | |
| Production scale | Development product |